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PRINANO’s First PL-SR Series Inkjet Step-and-Repeat Nanoimprint Equipment Successfully Delivered to Specialty Process CustomerIssuing time:2025-09-09 11:51 On August 1, 2025, PRINANO’s first independently designed and developed PL-SR series inkjet step-and-repeat nanoimprint equipment passed acceptance inspection and was delivered to a domestic specialty process customer. This delivery marks a new milestone in the company’s business expansion and market penetration, demonstrating its solid progress in high-end semiconductor equipment manufacturing.  The PL-SR series tackles critical technical challenges such as non-vacuum full contact bonding of step-and-repeat rigid plates, inkjet dispensing and thin-resist imprinting, and precise control of residual layer thickness, supporting nanoimprint lithography processes with <10 nm linewidth resolution. The equipment features PRINANO’s proprietary template surface control system, inkjet algorithm for nanoimprint resists, material compatibility for inkjet printing, and a self-developed software control system. It has completed preliminary R&D verification for memory chips, silicon-based micro-displays, silicon photonics, and advanced packaging.  
The PL-SR series achieves breakthrough performance in inkjet-dispensed nanoimprint materials, addressing multiple technical bottlenecks. For semiconductor-grade imprinting processes—often involving variable duty cycles and multi-period nanostructures—the equipment enables dynamic adjustment of resist volume based on structural patterns, ensuring thin and uniform resiNO has developed multiple resist systems compatible with inkjet step-and-repeat processesdual layers (<10 nm average, <2 nm variation) and high aspect ratios (>7:1). PRINA and subsequent semiconductor steps, including solvent-developable UV-curable resists that prevent costly quartz template contamination, providing reliable material support for high-precision imprinting.
Additionally, the PL-SR series overcomes technical hurdles in nanoimprint template flatness control. For high-end chips with minimum linewidth, rigid quartz templates require active surface shaping to compensate for inherent warping between quartz and silicon wafers, ensuring perfect contact during imprinting. This is particularly critical for ultra-thin resist coatings (~10 nm level). PRINANO’s proprietary template control technology resolves these challenges.
Nanoimprint Template Bonding and Demolding Process Post-imprint processes (e.g., etching) demand extreme uniformity and stability, especially for residual layer control. PRINANO optimizes equipment, materials, and processes to enable residue-free imprinting.
In high-end semiconductor manufacturing, alignment accuracy must break below 10 nm, approaching 1 nm—a technical and cost challenge comparable to EUV lithography. PRINANO advocates for collaborative innovation with domestic research institutes and enterprises specializing in precision alignment to overcome this bottleneck. Through joint efforts, PRINANO aims to develop internationally competitive step-and-repeat nanoimprint equipment, supporting China’s autonomous capabilities in next-generation chip manufacturing tools. The PL-SR is a versatile step-and-repeat nanoimprint system offering high efficiency, precision, and complex pattern stitching capabilities. It combines high-accuracy inkjet dispensing with alignment functions, achieving precise stitching alignment for nanoimprint processes. The system supports template stitching down to 20mm×20mm units, enabling 300mm (12-inch) wafer-scale patterning.
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